OC PitchLink™ devices are based on the OC GuideLink™ family of materials. Typical applications are as interconnect devices from VCSEL arrays to fiber ribbon or from AWG to individual fibers.

OC PitchLink™ transition devices can also be laminated in multi-layer arrays or to other materials such as FR4 circuit board or silicon.

Packaging is designed by Optical CrossLinks to meet the customer's environmental and mechanical needs